Published: Tuesday, June 24, 2025 · 4:20 PM | Updated: Tuesday, June 24, 2025 · 4:20 PM
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Apple (AAPL, Financial), Qualcomm (QCOM, Financial) and MediaTek are lining up 2-nanometer system-on-chips for a late-2026 debut, riding a surge in on-device AI demand and built by Taiwan Semiconductor Manufacturing Company (TSM, Financial).
Counterpoint Research forecasts that Apple will shift over 80% of its product lineup to 3 nm this year, setting the stage for an even swifter 2 nm rollout.
Counterpoint’s Parv Sharma says the push toward 3 nm and 2 nm nodes is fueled by the need for faster AI inference and better power efficiency on smartphones, though it lifts wafer costs and raises total semiconductor content per device.
TSMC plans tape-outs for 2 nm in H2 2025 and mass production in 2026, paving the way for flagship A-series, Snapdragon and Dimensity chips off the same line.
TSMC’s foundry dominance—owning roughly two-thirds of the market in Q4 2024 and an estimated 87% of sub-5 nm SoC shipments next year—should extend to 89% by 2028, says Counterpoint director Brady Wang.
That control gives TSMC and its chip-designer partners a clear path to deliver advanced-node scale, though rising node complexity may pressure yields and enlarge capex requirements.
Why It Matters: The transition to 2 nm will define the next wave of smartphone performance, battery life and AI features, with TSMC’s scale and Apple’s design muscle setting the competitive bar.
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